IMPACT 2011 and Workshop online registration is opened now!

Early bird discount before 9/30 !
ASE, SPIL, ChipMos, ICEP, iNEMI await you with refreshing changes

The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011)
organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan、ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA,
iNEMI, ICEP Japan and NTU is the most representative conference on electronic, 3D IC, Assembly and
Packaging industries which will take place in NTUH International Convention Center during October 18
to 21, 2011. IMPACT 2011 successfully attracted 185 papers not only from industry but also academic which come from 11 countries such as Japan, Korea, America, France, German, UK, India, and Thailand etc. Without doubt, it is the largest international seminar globally. IMPACT 2011 online registration is opened now! IMPACT Conference welcomes all elites register IMPACT Conference before Sep. 30th, you could enjoy big discount.

IMPACT organizer invites many outstanding plenary speakers this year such as ASE Senior Technical Advisor-Dr. William Chen will give an opening speech “The DNA of Packaging” on Oct. 19th opening ceremony. Furthermore, Director of Advanced Packaging Division in TSMC R&D/IIPD (Taiwan)-Mirng-Ji Lii will be invited to deliver “System / Packaging Migration beyond Moore’s Law”. Also, Dr. Charles E. Bauer (Senior Managing Director, TechLead Corp.) who is eminent in the field of Embedded Assembly will give the speech “Buried Parts Bring New Life to Electronics Packaging, Interconnection & Assembly; A History of Embedded Assembly Solutions for Electronic Systems” on Oct. 20^th. The last day, IMPACT organizer arranges Intel Vice President, Dr. Mostafa Aghazadeh, to address the topic “Enabling Computing Continuum Electronic Packaging Thru Material Innovations”. These extraordinary speakers are believed to initiate a new surge of IMPACT conference!

Furthermore, many prominent are invited, such as University of Greenwich Professor – Dr. Chris Bailey will address the topic “Commercial off the shelf (COTS) components for High Reliability Applications” and HKUST Professor - Dr. Shi-Wei Lee will analyze the latest tendency” Advanced LED Wafer Level Packaging Technologies”. Besides, the most well-known expert in Japan - Dr. Henry H. Utsunomiya will be invited to present “Technology Roadmap on 3D Integration”. Also, Nanyang Technology University Professor – Dr. Chuan-Seng Tan whose topic is “Wafer Level Hermetic Packaging with IMC-less Cu-Cu Bonding for 3D Microsystems”, Dr. Hirofumi Nakajima (Senior Manager, Renesas Electronics Corp.) will deliver the speech of “Semiconductor packages for automotive applications” and Dr. K.W.Paik (Professor, Advanced Institute of Science and Technology) will present the topic “Recent Progresses in Anisotropic Conductive Adhesives (ACAs) Technology”. In addition, “A novel high melting lead-Free mixed solder paste system” will be presented by Mr. Sze Pei Lim (The Vice President, Indium Corporation) and Dr. Shung-Wen Kang (Dean of Research and Development, Tamkang University) who will discuss the topic “Development and Application of Heat Pipe and Vapor Chamber Heat Spreader”. Moreover, David Wang (Vice President, ChipMOS) will bring about “Advanced Bump Interconnection Technologies” and Heinz Ru(Vice President, Tong Hsing) will deliver the speech “Direct Plated Copper (DPC) Technology for High Brightness LED Packaging”.

In addition to the invited speakers, short course will be held by IMPACT at first time on Oct.18^th, 2011. Dr. Yutaka Tsukada (Independent Consultant for Packaging Technology, i-PACKS; Guest Professor of Ritsumeikan University and Osaka University and IEEE Distinguished Lecturer) will be invited to present “Enabling Technologies for Flip Chip Packaging, Basics thru Future Direction- Bumping, Joint, Substrate, Reliability , 2D and 3D”. He will discuss the Flip Chip technology nowadays and the newest Japanese packaging technology trend. We believed this short course must attract more attendants definitely. Also, IMPACT 2011 is going to bring out advanced special sessions including 3D IC conference organized by SIPO and advanced technical session for U.S. and Japan shared by iNEMI and ICEP Japan which will present the developed packaging and assembly technology in the conference. The symbols of IMPACT are globalization and become the largest international conference through the efforts these years.

In addition, Famous industries-ASE, SPIL and ChipMOS are invited to join industry sessions and they will exchange opinions with elites in various fields all over the world and present the latest papers.  IMPACT 2011 is a great platform to grasp the newest technology globally. Now online registration is opened! Also, IMPACT conference 2011 proposes the discount plan this year: If a professor accompanied with five students register for IMPACT conference, the professor can require discount. Experts and academics from various fields are encouraged to register for IMPACT conference. Please see the official website (http://www.impact.org.tw ) or contact the secretariat (Tel: 886-3-3815659 #407). Besides, you can get early bird discount before Sep. 30. If you are eager to master the latest technology trends, you must not miss the 2011 IMPACT International conference!